Invention Grant
US09048232B2 Package with integrated pre-match circuit and harmonic suppression
有权
具有集成预匹配电路和谐波抑制的封装
- Patent Title: Package with integrated pre-match circuit and harmonic suppression
- Patent Title (中): 具有集成预匹配电路和谐波抑制的封装
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Application No.: US13459879Application Date: 2012-04-30
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Publication No.: US09048232B2Publication Date: 2015-06-02
- Inventor: Laurentius Cornelis Colussi , Johannes Geradus Willms
- Applicant: Laurentius Cornelis Colussi , Johannes Geradus Willms
- Applicant Address: NL 's-Hertogenbosch
- Assignee: Dialog Semiconductor B.V.
- Current Assignee: Dialog Semiconductor B.V.
- Current Assignee Address: NL 's-Hertogenbosch
- Agency: Saile Ackerman LLC
- Agent Stephen B. Ackerman; Rosemary L.S. Pike
- Main IPC: H05K7/00
- IPC: H05K7/00 ; H01L23/498 ; H01L23/552 ; H01L23/66 ; H05K1/02 ; H01L23/00 ; H05K1/11 ; H05K1/16
Abstract:
A package is connected at a first side to a printed circuit board and with a die fixed to it on a second side opposite to the first side. The package has an integrated pre-match circuit to provide an impedance match for a signal to be sent to a circuit external to the package. The signal has a predetermined main frequency component. The pre-match circuit has a pair of transmission lines and a pair of stubs on a predetermined layer of the package and connected to the pair of transmission lines. The pair of stubs have a length such as to form a short circuit for an harmonic frequency of the main frequency component in the signal.
Public/Granted literature
- US20130286620A1 Package with Integrated Pre-Match Circuit and Harmonic Suppression Public/Granted day:2013-10-31
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