Invention Grant
- Patent Title: Semiconductor device and method of manufacturing the same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US14458584Application Date: 2014-08-13
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Publication No.: US09048251B2Publication Date: 2015-06-02
- Inventor: Ryosuke Iijima , Yukio Nakabayashi , Tatsuo Shimizu
- Applicant: Kabushiki Kaisha Toshiba
- Applicant Address: JP Minato-ku
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Minato-ku
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2013-195113 20130920
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/16 ; H01L29/36 ; H01L21/28 ; H01L21/02 ; H01L21/302 ; H01L21/321

Abstract:
The semiconductor device of this embodiment includes: a first region of a first conductivity type SiC; a second region of a first conductivity type SiC, impurity concentration of first conductivity type of the second region being lower than impurity concentration of first conductivity type of the first region; a third region of a second conductivity type SiC provided between the first region and the second region; a Si layer provided on surfaces of the first, second, and third regions, a thickness of the Si layer on the third region being thicker than a thickness of the Si layer on the second region; a gate insulating film provided on the Si layer; and a date electrode provided on the gate insulating film.
Public/Granted literature
- US20150084067A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2015-03-26
Information query
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