Disclosed is a liquid treatment apparatus for processing a lower surface of the substrate. The apparatus includes a first nozzle disposed below a lower surface of the substrate retained by the substrate retaining unit to eject a treatment liquid towards the lower surface of the substrate, the first nozzle having a plurality of first ejection ports, which are arrayed from a position opposing a central portion of the substrate retained by the substrate retaining unit to a position opposing a peripheral portion of the substrate retained by the substrate retaining unit. An ejecting direction of the treatment liquid ejected from the first ejection port is inclined towards a rotation direction of the substrate rotated by the rotational driving unit.