Invention Grant
- Patent Title: Devices and method for handling microelectronics assemblies
- Patent Title (中): 用于处理微电子组件的装置和方法
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Application No.: US13054104Application Date: 2009-09-24
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Publication No.: US09048272B2Publication Date: 2015-06-02
- Inventor: Valoris L. Forsyth , Justin L. Lawrence , John E. Vannortwick , Jamie J. Wanke , Christopher E. Casey , Michael R. Forbis , James R. Stoor , Michael R. Slaughter
- Applicant: Valoris L. Forsyth , Justin L. Lawrence , John E. Vannortwick , Jamie J. Wanke , Christopher E. Casey , Michael R. Forbis , James R. Stoor , Michael R. Slaughter
- Applicant Address: US IL Glenview
- Assignee: ILLINOIS TOOL WORKS INC.
- Current Assignee: ILLINOIS TOOL WORKS INC.
- Current Assignee Address: US IL Glenview
- Agency: McCarter & English, LLP
- International Application: PCT/US2009/058197 WO 20090924
- International Announcement: WO2010/036790 WO 20100401
- Main IPC: B65D85/30
- IPC: B65D85/30 ; H01L21/673 ; B29C65/56 ; B29C45/00 ; B29C65/00 ; B29L12/00 ; B29L31/00
Abstract:
The disclosure relates to trays for the handling and shipping of computer chips, or similar microelectronic devices. The tray include a series of channels, each extending along a width of the tray. The channels include such devices as pins and clips for securing a thermoformed tape. The thermoformed tape includes pockets for storing the various computer chips, or similar microelectronic devices.
Public/Granted literature
- US20110259772A1 DEVICES AND METHOD FOR HANDLING MICROELECTRONICS ASSEMBLIES Public/Granted day:2011-10-27
Information query
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