Invention Grant
- Patent Title: Formation of thin layers of semiconductor materials
- Patent Title (中): 形成薄层半导体材料
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Application No.: US13202401Application Date: 2010-02-17
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Publication No.: US09048289B2Publication Date: 2015-06-02
- Inventor: Robert Cameron Harper
- Applicant: Robert Cameron Harper
- Applicant Address: GB South Glamorgan, Wales
- Assignee: IQE Silicon Compounds Limited
- Current Assignee: IQE Silicon Compounds Limited
- Current Assignee Address: GB South Glamorgan, Wales
- Agency: Hamilton, Brook, Smith & Reynolds, P.C.
- Priority: GB0902848.1 20090219
- International Application: PCT/GB2010/000287 WO 20100217
- International Announcement: WO2010/094920 WO 20100826
- Main IPC: H01L21/762
- IPC: H01L21/762 ; H01L21/02

Abstract:
There is disclosed a method of forming layers of either GaAs or germanium materials such as SiGe. The germanium material, for example, may be epitaxially grown on a GaAs surface. Layer transfer is used to transfer the germanium material, along with some residual GaAs, to a receiver substrate. The residual GaAs may be then removed by selective etching, with the boundary between the GaAs and the germanium material providing an etch stop.
Public/Granted literature
- US20110303291A1 FORMATION OF THIN LAYERS OF SEMICONDUCTOR MATERIALS Public/Granted day:2011-12-15
Information query
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