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US09048289B2 Formation of thin layers of semiconductor materials 有权
形成薄层半导体材料

Formation of thin layers of semiconductor materials
Abstract:
There is disclosed a method of forming layers of either GaAs or germanium materials such as SiGe. The germanium material, for example, may be epitaxially grown on a GaAs surface. Layer transfer is used to transfer the germanium material, along with some residual GaAs, to a receiver substrate. The residual GaAs may be then removed by selective etching, with the boundary between the GaAs and the germanium material providing an etch stop.
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