Invention Grant
- Patent Title: Thin film device and manufacturing method thereof
- Patent Title (中): 薄膜器件及其制造方法
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Application No.: US13585441Application Date: 2012-08-14
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Publication No.: US09048319B2Publication Date: 2015-06-02
- Inventor: Kazushige Takechi , Shinnosuke Iwamatsu , Seiya Kobayashi , Yoshiyuki Watanabe , Toru Yahagi
- Applicant: Kazushige Takechi , Shinnosuke Iwamatsu , Seiya Kobayashi , Yoshiyuki Watanabe , Toru Yahagi
- Applicant Address: JP Kanagawaw
- Assignee: NLT Technologies, Ltd.
- Current Assignee: NLT Technologies, Ltd.
- Current Assignee Address: JP Kanagawaw
- Agency: Sughrue Mion, PLLC
- Priority: JP2011-177614 20110815
- Main IPC: H01L29/786
- IPC: H01L29/786

Abstract:
With a TFT using an oxide semiconductor film, there is such an issue that oxygen deficit is generated in a surface region of the oxide semiconductor film after performing plasma etching of a source/drain electrode, thereby increasing the off-current. Provided is a TFT which includes: a gate electrode on an insulating substrate; a gate insulating film on the gate electrode; an oxide semiconductor film containing indium on the gate insulating film; and a source/drain electrode on the oxide semiconductor film. Further, the peak position derived from an indium 3d orbital in the XPS spectrum of a surface layer in a part of the oxide semiconductor film where the source/drain electrode is not superimposed is shifted towards a high energy side than the peak position derived from the indium 3d orbital in the XPS spectrum of an oxide semiconductor region existing in a lower part of the surface layer.
Public/Granted literature
- US20130043467A1 THIN FILM DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2013-02-21
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