Invention Grant
- Patent Title: Semiconductor device and manufacturing method thereof
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Application No.: US13686332Application Date: 2012-11-27
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Publication No.: US09048321B2Publication Date: 2015-06-02
- Inventor: Motomu Kurata , Shinya Sasagawa , Taiga Muraoka , Tetsuhiro Tanaka , Junichi Koezuka
- Applicant: Semiconductor Energy Laboratory Co., Ltd.
- Applicant Address: JP Atsugi-shi, Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Atsugi-shi, Kanagawa-ken
- Agency: Robinson Intellectual Property Law Office, P.C.
- Agent Eric J. Robinson
- Priority: JP2011-264383 20111202
- Main IPC: H01L29/10
- IPC: H01L29/10 ; H01L29/786 ; H01L29/66

Abstract:
Provided is a miniaturized transistor with stable and high electrical characteristics with high yield. In a semiconductor device including the transistor in which an oxide semiconductor film, a gate insulating film, and a gate electrode layer are stacked in this order, a first sidewall insulating layer is provided in contact with a side surface of the gate electrode layer, and a second sidewall insulating layer is provided to cover a side surface of the first sidewall insulating layer. The first sidewall insulating layer is an aluminum oxide film in which a crevice with an even shape is formed on its side surface. The second sidewall insulating layer is provided to cover the crevice. A source electrode layer and a drain electrode layer are provided in contact with the oxide semiconductor film and the second sidewall insulating layer.
Public/Granted literature
- US20130140555A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2013-06-06
Information query
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