Invention Grant
- Patent Title: Solid image-pickup device with flexible circuit substrate
- Patent Title (中): 具有柔性电路基板的固体摄像装置
-
Application No.: US13785421Application Date: 2013-03-05
-
Publication No.: US09048352B2Publication Date: 2015-06-02
- Inventor: Yukinobu Wataya
- Applicant: Sony Corporation
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Fishman Stewart Yamaguchi PLLC
- Priority: JP2001-308512 20011004
- Main IPC: H01L31/02
- IPC: H01L31/02 ; H01L27/146
Abstract:
A solid image pick-up device has a plurality of light sensors arranged on its image pick-up area of a semiconductor substrate. A transparent plate having the same shape and size as the semiconductor substrate is bonded to the surface of the semiconductor substrate. A plurality of bonding pads are formed on the surface of the semiconductor substrate and arranged around the image pick-up area. Further, a plurality of through holes are formed through the semiconductor substrate, extending from the lower surfaces of the bonding pads to the back surface of the semiconductor substrate. An insulating film is attached to the inner surface of each of the through holes, while another insulating film is attached to the back surface of the semiconductor substrate.
Public/Granted literature
- US20130241020A1 SOLID IMAGE-PICKUP DEVICE WITH FLEXIBLE CIRCUIT SUBSTRATE Public/Granted day:2013-09-19
Information query
IPC分类:
