Invention Grant
US09048357B2 Semiconductor structure, device comprising such a structure, and method for producing a semiconductor structure
有权
半导体结构,包括这种结构的器件,以及半导体结构的制造方法
- Patent Title: Semiconductor structure, device comprising such a structure, and method for producing a semiconductor structure
- Patent Title (中): 半导体结构,包括这种结构的器件,以及半导体结构的制造方法
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Application No.: US14370581Application Date: 2013-01-02
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Publication No.: US09048357B2Publication Date: 2015-06-02
- Inventor: Olivier Gravrand , Alexandre Ferron
- Applicant: Commissariat a l'energie atomique et aux ene alt
- Applicant Address: FR Paris
- Assignee: Commissariat à l'énergie atomique et aux énergies alternatives
- Current Assignee: Commissariat à l'énergie atomique et aux énergies alternatives
- Current Assignee Address: FR Paris
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: FR1250086 20120104
- International Application: PCT/EP2013/050020 WO 20130102
- International Announcement: WO2013/102631 WO 20130711
- Main IPC: H01L31/18
- IPC: H01L31/18 ; H01L31/0352 ; H01L31/0296 ; H01L31/101

Abstract:
A semi-conducting structure, configured to receive an electromagnetic radiation and to transform the electromagnetic radiation into an electric signal, including: a first zone and a second zone of a same conductivity type and of same elements; a barrier zone, provided between the first and second zones, for acting as a barrier to majority carriers of the first and second zones on a barrier thickness, the barrier zone having its lowest bandgap energy defining a barrier proportion; and a first interface zone configured to interface the first zone and the barrier zone on a first interface thickness, the first interface zone including a composition of elements which is varied from a proportion corresponding to that of the first material to the barrier proportion, the first interface thickness being at least equal to half the barrier thickness.
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