A multichip package structure for generating a symmetrical and uniform light-blending source includes a substrate unit, a light-emitting unit and a package unit. The substrate unit includes a substrate body and at least one bridging conductive layer disposed on the top surface of the substrate body. The light-emitting unit includes at least two first light-emitting elements diagonally disposed on the substrate body and electrically connected to the substrate body and at least two second light-emitting elements diagonally disposed on the substrate body and electrically connected to the substrate body. The package unit includes at least two first light-transmitting package bodies respectively covering the at least two first light-emitting elements and at least two second light-transmitting package bodies respectively covering the at least two second light-emitting elements.