Invention Grant
US09048415B2 Memory cells including top electrodes comprising metal silicide, apparatuses including such cells, and related methods
有权
包括包括金属硅化物的顶部电极,包括这种电池的装置的存储单元和相关方法
- Patent Title: Memory cells including top electrodes comprising metal silicide, apparatuses including such cells, and related methods
- Patent Title (中): 包括包括金属硅化物的顶部电极,包括这种电池的装置的存储单元和相关方法
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Application No.: US13347840Application Date: 2012-01-11
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Publication No.: US09048415B2Publication Date: 2015-06-02
- Inventor: Dale W. Collins , Marko Milojevic , Scott E. Sills , Si-Young Park
- Applicant: Dale W. Collins , Marko Milojevic , Scott E. Sills , Si-Young Park
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: TraskBritt
- Main IPC: H01L47/00
- IPC: H01L47/00 ; H01L45/00

Abstract:
Memory cells (e.g., CBRAM cells) include an ion source material over an active material and an electrode comprising metal silicide over the ion source material. The ion source material may include at least one of a chalcogenide material and a metal. Apparatuses, such as systems and devices, include a plurality of such memory cells. Memory cells include an adhesion material of metal silicide between a ion source material and an electrode of elemental metal. Methods of forming a memory cell include forming a first electrode, forming an active material, forming an ion source material, and forming a second electrode including metal silicide over the metal ion source material. Methods of adhering a material including copper and a material including tungsten include forming a tungsten silicide material over a material including copper and treating the materials.
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