Invention Grant
- Patent Title: Wire connecting device for connecting fiber-core conductor
- Patent Title (中): 用于连接纤维芯导体的线连接装置
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Application No.: US13820827Application Date: 2011-09-15
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Publication No.: US09048549B2Publication Date: 2015-06-02
- Inventor: Hisashi Hanazaki
- Applicant: Hisashi Hanazaki
- Applicant Address: JP Tokyo
- Assignee: Yazaki Corporation
- Current Assignee: Yazaki Corporation
- Current Assignee Address: JP Tokyo
- Agency: Locke Lord LLP
- Agent James E. Armstrong, IV; George N. Chaclas
- Priority: JP2010-216768 20100928
- International Application: PCT/JP2011/071762 WO 20110915
- International Announcement: WO2012/043422 WO 20120405
- Main IPC: H01R4/00
- IPC: H01R4/00 ; H01R4/06 ; H01B7/00 ; H05K3/32

Abstract:
A wire connecting device for connecting a fiber-core conductor configured by stranding a plurality of fiber-core conductive wires. The wire connecting device includes a vis having a rod-shape pin and a head extending outwardly from the pin. A plate-shape terminal connects with the vis by inserting the pin in an opening. The head matches up with an overlap portion of the terminal so that the fiber-core conductor is clamped between the head and the overlap portion of the terminal connect electrically the fiber-core conductor and the terminal. The conductor passes over and contacts an end portion of the pin. The pin and the inner surface of the opening are curved surfaces to eliminate sharp corners.
Public/Granted literature
- US20130175089A1 WIRE CONNECTING DEVICE FOR CONNECTING FIBER-CORE CONDUCTOR Public/Granted day:2013-07-11
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