Invention Grant
- Patent Title: Crimped terminal
- Patent Title (中): 压接终端
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Application No.: US13814118Application Date: 2011-07-15
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Publication No.: US09048550B2Publication Date: 2015-06-02
- Inventor: Masanori Onuma , Kousuke Takemura
- Applicant: Masanori Onuma , Kousuke Takemura
- Applicant Address: JP Tokyo
- Assignee: Yazaki Corporation
- Current Assignee: Yazaki Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2010-176046 20100805
- International Application: PCT/JP2011/066210 WO 20110715
- International Announcement: WO2012/017806 WO 20120209
- Main IPC: H01R4/10
- IPC: H01R4/10 ; H01R4/28 ; H01R4/18

Abstract:
In a crimp terminal (1) with a conductor crimp portion (11) having recessed serrations in the inner surface (11R), circular recesses (20) as serrations are provided in an inner surface (11R) of the conductor crimp portion (11) to be scattered so as to be spaced from each other before the conductor crimp portion (11) is crimped to a conductor (Wa) of an electric wire (W). A strip-shaped serration non-forming region (22) is provided in an intermediate portion in a front-back direction of the conductor crimp portion (11) and formed without the recesses (20).
Public/Granted literature
- US20130130567A1 CRIMPED TERMINAL Public/Granted day:2013-05-23
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