Invention Grant
- Patent Title: Waterproof structure for connector
- Patent Title (中): 连接器防水结构
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Application No.: US14195969Application Date: 2014-03-04
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Publication No.: US09048561B2Publication Date: 2015-06-02
- Inventor: Koichi Nakamura , Yuji Arita , Toru Suzuki
- Applicant: Yazaki Corporation
- Applicant Address: JP Tokyo
- Assignee: Yazaki Corporation
- Current Assignee: Yazaki Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2013-040430 20130301
- Main IPC: H01R13/40
- IPC: H01R13/40 ; H01R13/52 ; H01R13/424 ; H01R13/6582 ; H01R9/03 ; H01R13/6581

Abstract:
A waterproof structure for a connector includes a housing, a shield wire, a shield terminal, a first packing, and a second packing. The housing has a tubular housing part. The shield wire passes through the inside of the tubular housing part and extends from the housing. The shield terminal has a first section, a second section and a third section. The first section and the second section get into the tubular housing part such that the shield wire passes through the inside of the shield terminal, the first section joints with a braided shield wire of the shield wire, and the third section protrudes from the tubular housing part. The first packing seals a gap between the second section of the shield terminal and the tubular housing part. The second packing seals a gap between the shield wire and the third section of the shield terminal.
Public/Granted literature
- US20140248793A1 WATERPROOF STRUCTURE FOR CONNECTOR Public/Granted day:2014-09-04
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