Invention Grant
US09048614B2 Method and system for avoiding package induced failure in swept semiconductor source
有权
避免扫描半导体源中封装引起的故障的方法和系统
- Patent Title: Method and system for avoiding package induced failure in swept semiconductor source
- Patent Title (中): 避免扫描半导体源中封装引起的故障的方法和系统
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Application No.: US14150122Application Date: 2014-01-08
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Publication No.: US09048614B2Publication Date: 2015-06-02
- Inventor: Peter S. Whitney , Dale C. Flanders
- Applicant: Axsun Technologies, Inc.
- Applicant Address: US MA Billerica
- Assignee: Axsun Technologies, Inc.
- Current Assignee: Axsun Technologies, Inc.
- Current Assignee Address: US MA Billerica
- Agency: Houston & Associates, LLP
- Main IPC: H01S3/13
- IPC: H01S3/13 ; H01S5/026 ; H01S5/068 ; H01S5/14 ; G01B9/02 ; H01S5/183 ; H01S5/022 ; H01S5/024

Abstract:
Dry oxygen, dry air, or other gases such as ozone are hermetically sealed within the package of the external cavity laser or ASE swept source to avoid packaging-induced failure or PLF. PIF due to hydrocarbon breakdown at optical interfaces with high power densities is believed to occur at the SLED and/or SOA facets as well as the tunable Fabry-Perot reflector/filter elements and/or output fiber. Because the laser is an external cavity tunable laser and the configuration of the ASE swept sources, the power output can be low while the internal power at surfaces can be high leading to PIF at output powers much lower than the 50 mW.
Public/Granted literature
- US20140119397A1 Method and System for Avoiding Package Induced Failure in Swept Semiconductor Source Public/Granted day:2014-05-01
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