Invention Grant
- Patent Title: Motor heat dissipation structure with inbuilt electronic board
- Patent Title (中): 电机散热结构内置电子板
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Application No.: US13912645Application Date: 2013-06-07
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Publication No.: US09048709B2Publication Date: 2015-06-02
- Inventor: Da-Yi Chang
- Applicant: AIDEA COMPANY
- Applicant Address: TW Taichung
- Assignee: AIDEA COMPANY
- Current Assignee: AIDEA COMPANY
- Current Assignee Address: TW Taichung
- Agency: Sinorica, LLC
- Agent Ming Chow
- Main IPC: H02K1/32
- IPC: H02K1/32 ; H02K9/22 ; H02K11/00

Abstract:
A motor heat dissipation structure with an inbuilt electronic board includes a motor casing made of an aluminum material. The electronic board is disposed in the motor casing. Electronic components provided on one side of the electronic board are attached to the inner wall of one end of the motor casing. A heat dissipation metallic member is provided on electronic components on the other side of the electronic board. The heat dissipation metallic member extends to the circumferential side of the motor casing and is attached to the motor casing. Thus, the heat generated from the electronic components is conducted to the outside through the motor casing to enhance heat dissipation efficiency of the electronic board so as to protect the electronic board, preventing the electronic board from being overheated.
Public/Granted literature
- US20140361647A1 MOTOR HEAT DISSIPATION STRUCTURE WITH INBUILT ELECTRONIC BOARD Public/Granted day:2014-12-11
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