Invention Grant
US09048808B2 Sealed crystal oscillator and semiconductor package including the same 有权
密封晶体振荡器和包括其的半导体封装

Sealed crystal oscillator and semiconductor package including the same
Abstract:
A semiconductor package includes a package substrate; an integrated circuit chip formed on one surface of the package substrate; and a sealed quartz oscillator formed on at least one of an inside, one surface, and the other surface of the package substrate, wherein the sealed quartz oscillator includes a substrate, a quartz blank formed on one surface of the substrate, and a sealing cap covering at least one surface of the quartz blank and including metal.
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