Invention Grant
- Patent Title: Piezoelectric vibration element, manufacturing method for piezoelectric vibration element, piezoelectric resonator, electronic device, and electronic apparatus
- Patent Title (中): 压电振动元件,压电振动元件的制造方法,压电谐振器,电子器件和电子设备
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Application No.: US13486225Application Date: 2012-06-01
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Publication No.: US09048810B2Publication Date: 2015-06-02
- Inventor: Osamu Ishii
- Applicant: Osamu Ishii
- Applicant Address: JP
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: JP2011-125806 20110603; JP2012-002998 20120111
- Main IPC: H03H9/17
- IPC: H03H9/17 ; H01L41/053 ; H03H9/10 ; H03H9/05

Abstract:
A piezoelectric vibration element includes a piezoelectric substrate including a thin vibration region and a thick section integrated along three sides excluding one side of the vibration region, excitation electrodes respectively arranged on the front and rear surfaces of the vibration region, and lead electrodes. The thick section includes a first thick section and a second thick section arranged to be opposed to each other across the vibration region and a third thick section connected between proximal ends of the first and second thick sections. The second thick section includes an inclined section connected to the one side of the vibration region, a second thick section main body connected to the other side of the inclined section, and at least one slit for stress relaxation.
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Information query
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