Invention Grant
- Patent Title: Integration of piezoelectric materials with substrates
- Patent Title (中): 压电材料与基板的集成
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Application No.: US13874752Application Date: 2013-05-01
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Publication No.: US09048811B2Publication Date: 2015-06-02
- Inventor: David M. Chen , Jan H. Kuypers , Alexei Gaidarzhy , Guiti Zolfagharkhani , Jason Goodelle
- Applicant: Sand 9, Inc.
- Applicant Address: US MA Cambridge
- Assignee: Sand 9, Inc.
- Current Assignee: Sand 9, Inc.
- Current Assignee Address: US MA Cambridge
- Agency: Wolf, Greenfield & Sacks, P.C.
- Main IPC: H01L41/053
- IPC: H01L41/053 ; H03H9/10 ; H03H3/007 ; H03H9/02
Abstract:
Devices having piezoelectric material structures integrated with substrates are described. Fabrication techniques for forming such devices are also described. The fabrication may include bonding a piezoelectric material wafer to a substrate of a differing material. A structure, such as a resonator, may then be formed from the piezoelectric material wafer.
Public/Granted literature
- US20130313947A1 INTEGRATION OF PIEZOELECTRIC MATERIALS WITH SUBSTRATES Public/Granted day:2013-11-28
Information query
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