Invention Grant
- Patent Title: Front end module
- Patent Title (中): 前端模块
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Application No.: US13770884Application Date: 2013-02-19
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Publication No.: US09048898B2Publication Date: 2015-06-02
- Inventor: Myeong Woo Han , Youn Suk Kim , Shinichi Iizuka , Ju Young Park , Ki Joong Kim , Young Jean Song , Jun Goo Won
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon, Gyunggi-do
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon, Gyunggi-do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2012-0142922 20121210
- Main IPC: H04B1/04
- IPC: H04B1/04 ; H03H7/46 ; H03H7/38 ; H03F1/56

Abstract:
There is provided a front end module, including an amplification circuit unit amplifying signal, a multistage matching circuit unit connected to an output terminal of the amplification circuit unit, and a switch circuit unit connected to the multistage matching circuit unit, wherein the switch circuit unit includes a series switch circuit and a parallel switch circuit, the parallel switch circuit being connected to a node between a plurality of matching circuits included in the multistage matching circuit unit.
Public/Granted literature
- US20140162579A1 FRONT END MODULE Public/Granted day:2014-06-12
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