Invention Grant
- Patent Title: D2D relays as an underlay in LTE uplink
- Patent Title (中): D2D中继作为LTE上行链路的底层
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Application No.: US13605753Application Date: 2012-09-06
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Publication No.: US09049668B2Publication Date: 2015-06-02
- Inventor: Saurabh R. Tavildar , Bilal Sadiq , Libin Jiang , Junyi Li
- Applicant: Saurabh R. Tavildar , Bilal Sadiq , Libin Jiang , Junyi Li
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agent James K. O'Hare
- Main IPC: H04W52/38
- IPC: H04W52/38 ; H04W52/24 ; H04W52/46 ; H04W88/04
Abstract:
A method, an apparatus, and a computer program product for wireless communication are provided. The apparatus obtains at least one of a pathloss measurement to a base station or a maximum tolerable interference to the base station, determines a maximum transmission power for an access link to a user equipment (UE) based on the at least one of the pathloss measurement or the maximum tolerable interference to the base station, and communicates on the access link to the UE at a transmission power less than the determined maximum transmission power.
Public/Granted literature
- US20140066119A1 D2D RELAYS AS AN UNDERLAY IN LTE UPLINK Public/Granted day:2014-03-06
Information query
