A conductive thermoset material is provided that provides shielding against electromagnetic radiation. The conductive thermoset material includes an intermixed conductive material dispersed essentially throughout. An antisettling additive is present in the conductive thermoset material to support dispersion, optionally, homogenous dispersion of the conductive material in the resin. The conductive thermoset material is formable into one or more articles. The articles may be transportable and resistant to significant conductivity changes by contact with other surfaces.