An electrical component includes a substrate having a circuit area and a sacrificial area. A lift-off layer is deposited on the substrate in the sacrificial area. A seed layer is deposited on the substrate in the circuit area and on the lift-off layer in the sacrificial area. A plating layer is electrodeposited on the seed layer. The plating layer forms a circuit in the circuit area. The plating layer forms plating electrodes in the sacrificial area. The lift-off layer is removable from the substrate. The seed layer and the plating layer on the lift-off layer are removed with the lift-off layer when the lift-off layer is removed from the substrate, leaving the circuit on the substrate. The lift-off layer may be dissolved after the plating layer is formed, where the plating layer deposited on the lift-off layer is removed as the lift-off layer is dissolved.