Invention Grant
- Patent Title: Thermal management infrastructure for IT equipment in a cabinet
- Patent Title (中): 柜内IT设备的热管理基础设施
-
Application No.: US13623644Application Date: 2012-09-20
-
Publication No.: US09049803B2Publication Date: 2015-06-02
- Inventor: Ronald A. Nordin , Surendra Chitti Babu , Masud Bolouri-Saransar
- Applicant: Ronald A. Nordin , Surendra Chitti Babu , Masud Bolouri-Saransar
- Applicant Address: US IL Tinley Park
- Assignee: Panduit Corp.
- Current Assignee: Panduit Corp.
- Current Assignee Address: US IL Tinley Park
- Agent Christopher S. Clancy; Yuri Astvatsaturov
- Main IPC: H05K7/20
- IPC: H05K7/20 ; G06F1/20
Abstract:
The present invention attempts to reduce the thermal resistance with the use of heat-transfer devices (e.g., vapor chambers) placed directly on the heat-generating components in IT equipment and the integration of a cold plate within the cabinet. In some embodiments, the present invention is a thermal management system comprising a cabinet-side thermal management system and a server-side thermal management system using moveable thermal components.
Public/Granted literature
- US20130077232A1 THERMAL MANAGEMENT INFRASTRUCTURE FOR IT EQUIPMENT IN A CABINET Public/Granted day:2013-03-28
Information query
