Invention Grant
- Patent Title: Integrated device and manufacturing method
- Patent Title (中): 集成器件及制造方法
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Application No.: US12949488Application Date: 2010-11-18
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Publication No.: US09049806B2Publication Date: 2015-06-02
- Inventor: Masafumi Ide , Toru Takizawa , Kaoru Yoda
- Applicant: Masafumi Ide , Toru Takizawa , Kaoru Yoda
- Applicant Address: JP Tokyo
- Assignee: CITIZEN HOLDINGS CO., LTD.
- Current Assignee: CITIZEN HOLDINGS CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2009-265055 20091120
- Main IPC: G02F2/02
- IPC: G02F2/02 ; G02B6/12 ; H05K3/32 ; G02B6/42 ; H05K1/11 ; G02F1/35 ; H01S5/022 ; H05K1/02 ; H05K1/03
Abstract:
An integrated device includes an optical element and an electrical element that are implemented on a substrate. The optical element and the electrical element are bonded by surface-activated bonding technology to a bonding portion that is formed on the substrate and made of metal material.
Public/Granted literature
- US20110122481A1 INTEGRATED DEVICE AND MANUFACTURING METHOD Public/Granted day:2011-05-26
Information query
