Invention Grant
- Patent Title: Device mounter head and device mounting method using the same
- Patent Title (中): 装置安装头和装置安装方法使用该装置
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Application No.: US13159048Application Date: 2011-06-13
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Publication No.: US09049810B2Publication Date: 2015-06-02
- Inventor: Jong-eok Ban
- Applicant: Jong-eok Ban
- Applicant Address: KR Changwon
- Assignee: SAMSUNG TECHWIN CO., LTD.
- Current Assignee: SAMSUNG TECHWIN CO., LTD.
- Current Assignee Address: KR Changwon
- Agency: Sughrue Mion, PLLC
- Priority: KR10-2010-0056199 20100614
- Main IPC: B23Q7/00
- IPC: B23Q7/00 ; H05K13/04

Abstract:
A device mounter head and a device mounting method using the device mounter head are provided. The device mounter head includes: a cylinder block unit including at least one cylinder in which a piston unit moving along the at least one cylinder is disposed; a pressure control unit which controls pressure inside and outside the at least one cylinder so that the piston moves along the at least one cylinder based on the controlled pressure; and a nozzle which is connected to the piston unit, and includes an inlet exposed to an atmosphere outside the cylinder block unit and a nozzle communication vent connected to the inlet and provided with the controlled pressure, wherein the inlet is configured to suck, grab and release a component using the controlled pressure.
Public/Granted literature
- US20110302766A1 DEVICE MOUNTER HEAD AND DEVICE MOUNTING METHOD USING THE SAME Public/Granted day:2011-12-15
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