Invention Grant
- Patent Title: Ultrasound endoscope
- Patent Title (中): 超声内窥镜
-
Application No.: US13965414Application Date: 2013-08-13
-
Publication No.: US09050052B2Publication Date: 2015-06-09
- Inventor: Kei Irie
- Applicant: OLYMPUS MEDICAL SYSTEMS CORP.
- Applicant Address: JP Tokyo
- Assignee: OLYMPUS MEDICAL SYSTEMS CORP.
- Current Assignee: OLYMPUS MEDICAL SYSTEMS CORP.
- Current Assignee Address: JP Tokyo
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Priority: JP2012-186871 20120827
- Main IPC: A61B8/14
- IPC: A61B8/14 ; A61B8/00 ; A61B8/12

Abstract:
A wiring board electrically connected to a back side of an ultrasound transmitting/receiving section that transmits/receives ultrasound includes a rigid circuit board included in a stiff portion, and a wrapping portion extending out from the rigid circuit board (stiff portion), and a plurality of drive wirings electrically connected to the wiring board are inserted into a wiring insertion portion of a housing with the plurality of drive wirings wrapped and bundled by the wrapping portion.
Public/Granted literature
- US20140058269A1 ULTRASOUND ENDOSCOPE Public/Granted day:2014-02-27
Information query