Invention Grant
- Patent Title: Wire discharge-machining apparatus with parallel cutting wires
- Patent Title (中): 具有平行切割线的排线加工装置
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Application No.: US12999106Application Date: 2009-06-16
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Publication No.: US09050672B2Publication Date: 2015-06-09
- Inventor: Hidetaka Miyake , Tatsushi Sato
- Applicant: Hidetaka Miyake , Tatsushi Sato
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2008-157236 20080616
- International Application: PCT/JP2009/060946 WO 20090616
- International Announcement: WO2009/154199 WO 20091223
- Main IPC: B23H7/02
- IPC: B23H7/02 ; H01L21/78 ; B23H7/10 ; B23H1/02 ; B23H7/08 ; B23H9/00 ; B23H11/00 ; B28D5/04

Abstract:
A wire machining method includes: a wire electrode set as cutting wires provided in parallel with a distance between the cutting wires of which a predetermined regional part faces a workpiece; a machining power source that generates a pulse-shaped machining voltage; and plural feeder units that are electrically connected to the plural cutting wires respectively of the wire electrode and supply the machining voltage between the cutting wires and the workpiece respectively. The feeder units are arranged such that a direction of a current passed to at least a part of the cutting wires becomes a direction different from a direction of a current passed to other cutting wires.
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