A laser dicing method of a work piece on a surface of which a metal film is provided, includes: a first metal film removing of irradiating a pulse laser beam defocused from the metal film, along a first line, and removing the metal film; a second metal film removing of irradiating the pulse laser beam defocused from the metal film, along a second line orthogonal to the first line, and removing the metal film; and a crack forming of irradiating the pulse laser beam in an area from which the metal film of the work piece is removed, and forming the crack in the work piece, and, in an area in which the first line and the second line cross, irradiation of the pulse laser beam is interrupted in the first metal film removing or the second metal film removing.