Invention Grant
- Patent Title: Method for cutting carbon fiber substrate
- Patent Title (中): 切割碳纤维基材的方法
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Application No.: US13635721Application Date: 2010-12-14
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Publication No.: US09050689B2Publication Date: 2015-06-09
- Inventor: Kohnosuke Yamamoto , Masaaki Yamasaki , Toshihide Sekido
- Applicant: Kohnosuke Yamamoto , Masaaki Yamasaki , Toshihide Sekido
- Applicant Address: JP
- Assignee: Toray Industries, Inc.
- Current Assignee: Toray Industries, Inc.
- Current Assignee Address: JP
- Agency: DLA Piper LLP (US)
- Priority: JP2010-064763 20100319
- International Application: PCT/JP2010/072473 WO 20101214
- International Announcement: WO2011/114592 WO 20110922
- Main IPC: B23K26/40
- IPC: B23K26/40 ; D06H7/22 ; B23K26/38 ; B23K26/14 ; B23K26/16 ; B23K26/30

Abstract:
A method for laser-cutting a carbon fiber substrate such as a preform is configured from fabric material comprising at least carbon fibers, characterized by cutting the carbon fiber substrate at initial conditions which have been set so that the state of the substrate that is being cut with a laser can be suppressed with or prevented from deviating from a target state. By the method, it is possible to effectively solve various problems such as dissipation of heat, positional shifting from the focal length range of the laser, and soot, and the carbon fiber substrate can be stably cut at the target desired state.
Public/Granted literature
- US20130001206A1 METHOD FOR CUTTING CARBON FIBER SUBSTRATE Public/Granted day:2013-01-03
Information query
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