Invention Grant
US09050700B2 Methods and apparatus for an improved polishing head retaining ring
有权
用于改进的抛光头保持环的方法和装置
- Patent Title: Methods and apparatus for an improved polishing head retaining ring
- Patent Title (中): 用于改进的抛光头保持环的方法和装置
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Application No.: US13360221Application Date: 2012-01-27
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Publication No.: US09050700B2Publication Date: 2015-06-09
- Inventor: Hung Chih Chen , Jay Gurusamy , Gautam S. Dandavate , Samuel Chu-Chiang Hsu
- Applicant: Hung Chih Chen , Jay Gurusamy , Gautam S. Dandavate , Samuel Chu-Chiang Hsu
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Dugan & Dugan, PC
- Main IPC: B24B1/00
- IPC: B24B1/00 ; B24B37/32 ; B24B37/34
Abstract:
Methods, apparatus, and systems are provided for retaining a substrate in a polishing head of a CMP system. The invention includes a flexible inner retaining ring adapted to contour to an edge of a substrate and an inner ring support coupled to the polishing head. The inner support ring is adapted to contact the flexible inner retaining ring in response to a side force load applied to the flexible inner retaining ring by a substrate being polished. Numerous additional aspects are disclosed.
Public/Granted literature
- US20130196577A1 METHODS AND APPARATUS FOR AN IMPROVED POLISHING HEAD RETAINING RING Public/Granted day:2013-08-01
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