Methods and apparatuses discussed herein provide for localized speed changes of an advancing substrate. Embodiments of a localized speed varying apparatus may include first and second substrate guides positioned upstream and downstream of a processing station, respectively. The substrate guides may utilize orbital motion of guide members to change the length of the substrate within the substrate guides upstream and downstream of the processing station. The changes in substrate length within the substrate guides result in localized speed changes of the substrate between the substrate guides. Coordination between the substrate guides allows for localized speed changes of the substrate passing through the processing station without affecting the speed of the substrate upstream of the first substrate guide and downstream of the second substrate guide.