A printing apparatus includes: a mask formed with a pattern hole for printing; a printing mechanism having a squeegee that comes into contact with a front surface of the mask at a predetermined contact angle, the printing mechanism causing the squeegee to slide on the front surface of the mask with a predetermined printing pressure to move a solder on the front surface of the mask while scraping the solder by the squeegee, thereby printing the solder to a substrate via the pattern hole; a detection device executing detection operation for detecting a physical quantity that changes in accordance with an amount of solder on the front surface of the mask; and a control device adjusting at least one of the contact angle and the printing pressure of the squeegee on the basis of the physical quantity detected by the detection device.