Invention Grant
- Patent Title: Method for encapsulating an MEMS component
- Patent Title (中): 封装MEMS部件的方法
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Application No.: US13003148Application Date: 2009-07-06
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Publication No.: US09051174B2Publication Date: 2015-06-09
- Inventor: Wolfgang Pahl , Gregor Feiertag
- Applicant: Wolfgang Pahl , Gregor Feiertag
- Applicant Address: DE Munich
- Assignee: EPCOS AG
- Current Assignee: EPCOS AG
- Current Assignee Address: DE Munich
- Agency: Nixon Peabody LLP
- Priority: DE102008032319 20080709
- International Application: PCT/EP2009/058520 WO 20090706
- International Announcement: WO2010/003925 WO 20100114
- Main IPC: B81C1/00
- IPC: B81C1/00

Abstract:
Method for producing an MST device, and MST deviceA method for producing an electromechanical transducer is described, wherein an MST component is arranged in a container, and the container is closed with a cover layer, wherein the cover layer is provided with at least one cutout which divides the cover layer into an inner region and an outer region in such a way that both the inner region and the outer region are connected to the top side—facing the cover layer—of the MST component, and the inner region is lifted off while the outer region remains adhered.
Public/Granted literature
- US20110180885A1 METHOD FOR ENCAPSULATING AN MEMS COMPONENT Public/Granted day:2011-07-28
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