Invention Grant
US09051174B2 Method for encapsulating an MEMS component 有权
封装MEMS部件的方法

  • Patent Title: Method for encapsulating an MEMS component
  • Patent Title (中): 封装MEMS部件的方法
  • Application No.: US13003148
    Application Date: 2009-07-06
  • Publication No.: US09051174B2
    Publication Date: 2015-06-09
  • Inventor: Wolfgang PahlGregor Feiertag
  • Applicant: Wolfgang PahlGregor Feiertag
  • Applicant Address: DE Munich
  • Assignee: EPCOS AG
  • Current Assignee: EPCOS AG
  • Current Assignee Address: DE Munich
  • Agency: Nixon Peabody LLP
  • Priority: DE102008032319 20080709
  • International Application: PCT/EP2009/058520 WO 20090706
  • International Announcement: WO2010/003925 WO 20100114
  • Main IPC: B81C1/00
  • IPC: B81C1/00
Method for encapsulating an MEMS component
Abstract:
Method for producing an MST device, and MST deviceA method for producing an electromechanical transducer is described, wherein an MST component is arranged in a container, and the container is closed with a cover layer, wherein the cover layer is provided with at least one cutout which divides the cover layer into an inner region and an outer region in such a way that both the inner region and the outer region are connected to the top side—facing the cover layer—of the MST component, and the inner region is lifted off while the outer region remains adhered.
Public/Granted literature
Information query
Patent Agency Ranking
0/0