Invention Grant
- Patent Title: Resin composition
- Patent Title (中): 树脂组成
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Application No.: US13738153Application Date: 2013-01-10
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Publication No.: US09051450B2Publication Date: 2015-06-09
- Inventor: Tatsuya Ganbe , Yuji Takematsu , Kenji Okamoto
- Applicant: FUJI ELECTRIC CO., LTD.
- Applicant Address: JP
- Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee Address: JP
- Agency: Rossi, Kimms & McDowell LLP
- Priority: JP2010-223685 20101001
- Main IPC: H01L23/22
- IPC: H01L23/22 ; H01L21/00 ; C08K3/36 ; H01L31/0216 ; C08G59/32 ; C08K3/00 ; C08K3/22 ; C08K3/28 ; C08K3/38 ; C08L63/00 ; H01L23/29 ; H01L21/56 ; H01L31/0203 ; H01L31/048 ; H01L23/31
Abstract:
A resin composition for obtaining a cured resin material exhibiting improved heat resistance and a higher glass transition temperature is disclosed. The resin composition contains a resin selected from a) a thermosetting resin and a curing agent, or b) a thermoplastic resin, and an inorganic filler with an average particle diameter of 1000 nm or less.
Public/Granted literature
- US20130105929A1 RESIN COMPOSITION Public/Granted day:2013-05-02
Information query
IPC分类:
