Invention Grant
- Patent Title: Polymer compositions for temporary bonding
- Patent Title (中): 用于临时粘合的聚合物组合物
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Application No.: US14105324Application Date: 2013-12-13
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Publication No.: US09051452B2Publication Date: 2015-06-09
- Inventor: Larry F Rhodes , Leah J Langsdorf , Venkat Dukkipati
- Applicant: Promerus, LLC
- Applicant Address: US OH Brecksville
- Assignee: PROMERUS, LLC
- Current Assignee: PROMERUS, LLC
- Current Assignee Address: US OH Brecksville
- Agent Balaram Gupta
- Main IPC: G03G9/097
- IPC: G03G9/097 ; B41M7/00 ; B29C71/04 ; A61L2/08 ; A61L24/00 ; C08F2/46 ; C08G61/04 ; C08K5/41 ; C08K5/04 ; C08K5/16 ; H01L21/683 ; C08K5/1535 ; C08K5/5419 ; C08K5/5425 ; C08K5/548
Abstract:
Embodiments in accordance with the present invention are directed to poly(lactide) compositions that are useful for forming temporary bonding layers that serve to releasably join a first substrate to a second substrate as well as methods of both forming such a temporary bond and methods of debonding such substrates. Some such poly(lactide) compositions encompass a casting solvent, a photoacid generator and optionally a sensitizer and/or an adhesion promoter.
Public/Granted literature
- US20140102631A1 POLYMER COMPOSITIONS FOR TEMPORARY BONDING Public/Granted day:2014-04-17
Information query
