Invention Grant
US09051669B2 Multilayer pads and methods of manufacture employing thermal bonding 有权
多层焊盘和使用热粘合的制造方法

Multilayer pads and methods of manufacture employing thermal bonding
Abstract:
In-line methods for manufacturing a plurality of multilayer pads and the resultant pads. Various embodiments of the invention employ one or two thermal bonding stations, such as ultrasonic bonding stations, along with handle folding tooling, to produce two- or three-layer pads in various configurations, without the use of adhesive. Following bonding and handle folding, a cutter, such as a die cutter, is employed to cut through the layers to form individual pads. Pads of various configurations are manufactured, including pads with “L”-shaped handles, handles of “wing” configuration, and “folded” handles.
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