Invention Grant
- Patent Title: Multilayer pads and methods of manufacture employing thermal bonding
- Patent Title (中): 多层焊盘和使用热粘合的制造方法
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Application No.: US13188855Application Date: 2011-07-22
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Publication No.: US09051669B2Publication Date: 2015-06-09
- Inventor: James M. Woods , Marilyn S. Woods
- Applicant: James M. Woods , Marilyn S. Woods
- Agency: Luedeka Neely Group, P.C.
- Main IPC: D04H1/593
- IPC: D04H1/593 ; A47K7/02 ; B32B3/08 ; B32B5/02 ; B32B5/08 ; B32B27/12 ; B32B27/32

Abstract:
In-line methods for manufacturing a plurality of multilayer pads and the resultant pads. Various embodiments of the invention employ one or two thermal bonding stations, such as ultrasonic bonding stations, along with handle folding tooling, to produce two- or three-layer pads in various configurations, without the use of adhesive. Following bonding and handle folding, a cutter, such as a die cutter, is employed to cut through the layers to form individual pads. Pads of various configurations are manufactured, including pads with “L”-shaped handles, handles of “wing” configuration, and “folded” handles.
Public/Granted literature
- US20120021187A1 MULTILAYER PADS AND METHODS OF MANUFACTURE EMPLOYING THERMAL BONDING Public/Granted day:2012-01-26
Information query
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