A ceiling system including, among other things, a clip adapted for attachment to a ceiling or a wall. The clip has at least one panel engagement surface, at least one molding surface, and at least one molding attachment member positioned adjacent to the at least one molding surface. The system further includes a panel having an interior surface adapted for engagement with a ceiling or a wall and an exterior surface adapted for engagement with the at least one panel engagement surface. The system further includes a molding having a surface adapted for engagement with the at least one molding surface and a slot adapted for engagement with the at least one molding attachment member.