Invention Grant
- Patent Title: Dual circuit heat pump
- Patent Title (中): 双回路热泵
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Application No.: US13599522Application Date: 2012-08-30
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Publication No.: US09052125B1Publication Date: 2015-06-09
- Inventor: Dennis S. Dostal
- Applicant: Dennis S. Dostal
- Agency: Westman, Champlin & Koehler, P.A.
- Agent Leanne Taveggia Farrell
- Main IPC: F25B7/00
- IPC: F25B7/00

Abstract:
A heat pump includes a compressor for compressing refrigerant. The compressed refrigerant is divided into a first portion and a second portion. Simultaneously, the first portion of the refrigerant is used in a first vapor-compression circuit to heat or cool a space and the second portion of the refrigerant is used in a second vapor-compression circuit to heat a fluid. In a single external source heat exchanger, both the first portion of the refrigerant in the first vapor-compression circuit and the second portion of the refrigerant in the second vapor compression circuit exchanges heat with an external source fluid.
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