Invention Grant
- Patent Title: High density plate filler
- Patent Title (中): 高密度板填料
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Application No.: US13049686Application Date: 2011-03-16
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Publication No.: US09052298B2Publication Date: 2015-06-09
- Inventor: Mark T. Reed , Albert L. Carrillo , Ian A. Harding
- Applicant: Mark T. Reed , Albert L. Carrillo , Ian A. Harding
- Applicant Address: US CA Carlsbad
- Assignee: APPLIED BIOSYSTEMS, LLC
- Current Assignee: APPLIED BIOSYSTEMS, LLC
- Current Assignee Address: US CA Carlsbad
- Main IPC: B01L3/00
- IPC: B01L3/00 ; G01N35/02 ; G01N21/64 ; B01L3/02 ; B01L7/00 ; B01L9/00 ; G01N21/27

Abstract:
A filling apparatus for filling a microplate. The microplate can comprise a plurality of wells each sized to receive an assay. A substrate can comprise a first surface and an opposing second surface, a first assay input port for receiving the assay disposed on the first surface, a plurality of staging capillaries extending through the substrate, and a first plurality of microfluidic channels fluidly coupling the first assay input port with at least one of the plurality of staging capillaries. Each of the plurality of staging capillaries can comprise an inlet and an outlet and be sized to receive the assay.
Public/Granted literature
- US20110220239A1 HIGH DENSITY PLATE FILLER Public/Granted day:2011-09-15
Information query
IPC分类: