Invention Grant
- Patent Title: Self-aligned chip carrier and package structure thereof
- Patent Title (中): 自对准芯片载体及其封装结构
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Application No.: US13907984Application Date: 2013-06-03
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Publication No.: US09052446B2Publication Date: 2015-06-09
- Inventor: Wen-Chin Lee
- Applicant: Industrial Technology Research Institute
- Applicant Address: TW Hsinchu
- Assignee: Industrial Technology Research Institute
- Current Assignee: Industrial Technology Research Institute
- Current Assignee Address: TW Hsinchu
- Agency: Jianq Chyun IP Office
- Priority: TW102110276A 20130322
- Main IPC: G02B6/42
- IPC: G02B6/42 ; G02B6/12 ; H01L23/48
Abstract:
The disclosure relates to a chip carrier, suitable for being inserted into a corresponding substrate. The light emitting/receiving chip mounted on the chip carrier is disposed within the corresponding substrate and aligned to the waveguide embedded in the corresponding substrate with an appropriate distance.
Public/Granted literature
- US20140286605A1 SELF-ALIGNED CHIP CARRIER AND PACKAGE STRUCTURE THEREOF Public/Granted day:2014-09-25
Information query
