Invention Grant
US09052483B2 Communication module assembly with heat sink and methods of manufacture
有权
具有散热器的通信模块组件和制造方法
- Patent Title: Communication module assembly with heat sink and methods of manufacture
- Patent Title (中): 具有散热器的通信模块组件和制造方法
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Application No.: US13629260Application Date: 2012-09-27
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Publication No.: US09052483B2Publication Date: 2015-06-09
- Inventor: Long Van Nguyen
- Applicant: FINISAR CORPORATION
- Applicant Address: US CA Sunnyvale
- Assignee: FINISAR CORPORATION
- Current Assignee: FINISAR CORPORATION
- Current Assignee Address: US CA Sunnyvale
- Agency: Maschoff Brennan
- Main IPC: H05K7/20
- IPC: H05K7/20 ; G02B6/42

Abstract:
A communication assembly can include: a module device; a cage having a body defining a first open end that is configured to receive the module device therethrough and the body defining one or more first receiver members between the first end and a second end opposite of the first end, the one or more first receiver members having a first part of fastening system (e.g., two-part fastening system); and a heat sink adapted to be received into the cage so as to be thermally coupled with the module device, the heat sink having a body defining one or more second receiver members configured to receive the one or more first receiver members, the one or more second receiver members having a second part of the fastening system that couples with the first part of the fastening system.
Public/Granted literature
- US20130077254A1 COMMUNICATION MODULE ASSEMBLY WITH HEAT SINK AND METHODS OF MANUFACTURE Public/Granted day:2013-03-28
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