Invention Grant
- Patent Title: Optical interconnect assembly
- Patent Title (中): 光互连组件
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Application No.: US13759696Application Date: 2013-02-05
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Publication No.: US09052485B2Publication Date: 2015-06-09
- Inventor: Daric Laughlin , Philip Abel
- Applicant: Honeywell Federal Manufacturing & Technologies, LLC
- Applicant Address: US MO Kansas City
- Assignee: Honeywell Federal Manufacturing & Technologies, LLC
- Current Assignee: Honeywell Federal Manufacturing & Technologies, LLC
- Current Assignee Address: US MO Kansas City
- Agency: Hovey Williams LLP
- Main IPC: G02B6/43
- IPC: G02B6/43 ; G02B6/12

Abstract:
An optical assembly includes a substrate with a first row of apertures and a second row of apertures. A first optical die includes a first plurality of optical transducer elements and is mounted on the substrate such that an optical signal interface of each transducer element is aligned with an aperture of the first row of optical apertures. A second optical die includes a second plurality of optical transducer elements and is mounted on the substrate such that an optical signal interface of each of the second plurality of optical transducer elements is aligned with an aperture of the second row of optical apertures. A connector configured to mate with the optical assembly supports a plurality of optical fibers. A terminal end of each optical fiber protrudes from the connector and extends into one of the apertures when the connector is coupled with the optical assembly.
Public/Granted literature
- US20140219603A1 OPTICAL INTERCONNECT ASSEMBLY Public/Granted day:2014-08-07
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