Invention Grant
- Patent Title: Resist composition and resist pattern forming method
- Patent Title (中): 抗蚀剂组成和抗蚀剂图案形成方法
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Application No.: US14218249Application Date: 2014-03-18
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Publication No.: US09052592B2Publication Date: 2015-06-09
- Inventor: Tsuyoshi Nakamura , Kazuishi Tanno , Akiya Kawaue , Takayoshi Mori
- Applicant: Tokyo Ohka Kogyo Co., Ltd.
- Applicant Address: JP Kawasaki-shi
- Assignee: Tokyo Ohka Kogyo Co., Ltd.
- Current Assignee: Tokyo Ohka Kogyo Co., Ltd.
- Current Assignee Address: JP Kawasaki-shi
- Agency: Knobbe Martens Olson & Bear LLP
- Priority: JP2013-062887 20130325
- Main IPC: G03F7/004
- IPC: G03F7/004 ; C08F28/00 ; G03F7/038 ; C08F220/24 ; C08F220/56 ; C08F20/52 ; C07C381/12

Abstract:
A resist composition contains a high-molecular weight compound which has a partial structure represented by a general formula (a0-r-1) and has a constituent unit represented by a general formula (a0-1). In the formula (a0-r-1), Y1 represents a divalent linking group; each of R2 and R3 represents a group having 0 to 20 carbon atoms, which is not a fluorine atom, and either R2 or R3 may form a ring with Y1; m represents an integer of 1 or more; and Mm+ represents an m-valent organic cation. In the formula (a0-1), R represents a hydrogen atom, an alkyl group, or a halogenated alkyl group; Ya01 represents a single bond or a divalent linking group; X01 represents a sulfur atom or an oxygen atom; and Ra01 represents an optionally substituted cyclic group, chain alkyl group or chain alkenyl group.
Public/Granted literature
- US20140287360A1 RESIST COMPOSITION AND RESIST PATTERN FORMING METHOD Public/Granted day:2014-09-25
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