Invention Grant
- Patent Title: Resist composition and patterning process
- Patent Title (中): 抗蚀剂组成和图案化工艺
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Application No.: US13890396Application Date: 2013-05-09
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Publication No.: US09052593B2Publication Date: 2015-06-09
- Inventor: Jun Hatakeyama , Masayoshi Sagehashi
- Applicant: SHIN-ETSU CHEMICAL CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: SHIN-ETSU CHEMICAL CO., LTD.
- Current Assignee: SHIN-ETSU CHEMICAL CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2012-112246 20120516
- Main IPC: G03F7/039
- IPC: G03F7/039 ; G03F7/20

Abstract:
A polymer is obtained from copolymerization of a unit having a carboxyl and/or phenolic hydroxyl group substituted with an acid labile group with a hydroxyphenyl methacrylate unit having one acyl, acyloxy or alkoxycarbonyl group. The polymer is useful as a base resin in a positive resist composition. The resist composition comprising the polymer is improved in contrast of alkali dissolution rate before and after exposure, acid diffusion control, resolution, and profile and edge roughness of a pattern after exposure.
Public/Granted literature
- US20130323646A1 RESIST COMPOSITION AND PATTERNING PROCESS Public/Granted day:2013-12-05
Information query
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