Invention Grant
US09052602B2 Developer for photosensitive resist material and patterning process
有权
光敏抗蚀剂材料和图案化工艺的显影剂
- Patent Title: Developer for photosensitive resist material and patterning process
- Patent Title (中): 光敏抗蚀剂材料和图案化工艺的显影剂
-
Application No.: US14287906Application Date: 2014-05-27
-
Publication No.: US09052602B2Publication Date: 2015-06-09
- Inventor: Jun Hatakeyama , Masaki Ohashi
- Applicant: SHIN-ETSU CHEMICAL CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: SHIN-ETSU CHEMICAL CO., LTD.
- Current Assignee: SHIN-ETSU CHEMICAL CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2013-123335 20130612
- Main IPC: G03F7/32
- IPC: G03F7/32 ; G03F7/38 ; G03F7/26 ; G03F7/20

Abstract:
An aqueous solution containing 0.1-20 wt % of a cyclic ammonium hydroxide is a useful developer for photosensitive resist materials. A resist pattern is formed by applying a chemically amplified positive resist composition onto a substrate to form a resist film, exposing the resist film to high-energy radiation, and developing the exposed resist film in a cyclic ammonium hydroxide-containing aqueous solution.
Public/Granted literature
- US20140370441A1 DEVELOPER FOR PHOTOSENSITIVE RESIST MATERIAL AND PATTERNING PROCESS Public/Granted day:2014-12-18
Information query
IPC分类: