Invention Grant
- Patent Title: Method of manufacturing piezoelectric vibration reed, piezoelectric vibration reed, piezoelectric vibrator, oscillator, electronic instrument, and radio time piece
- Patent Title (中): 制造压电振动片的方法，压电振动片，压电振动器，振荡器，电子仪器和无线电时间片
-
Application No.: US13630103Application Date: 2012-09-28
-
Publication No.: US09052699B2Publication Date: 2015-06-09
- Inventor: Daishi Arimatsu
- Applicant: Seiko Instruments Inc.
- Applicant Address: JP Chiba
- Assignee: SII CRYSTAL TECHNOLOGY INC.
- Current Assignee: SII CRYSTAL TECHNOLOGY INC.
- Current Assignee Address: JP Chiba
- Agency: Brinks Gilson & Lione
- Priority: JP2011-218238 20110930
- Main IPC: H01L41/22
- IPC: H01L41/22 ; H01L41/00 ; G04R20/00 ; G04R20/10 ; H03H3/04 ; H03H9/10 ; H03H9/21
Abstract:
A method of manufacturing a piezoelectric vibration reed is provided. The piezoelectric vibration reed includes a pair of vibrating arm portions and a base portion. The pair of vibrating arm portions is disposed in parallel to each other. The base portion is configured to integrally support proximal end portions of the pair of vibrating arm portions in a longitudinal direction of the vibrating arm portions. The method of manufacturing the piezoelectric vibration reed forms a slit-shaped notched portion at a crotch portion located between the proximal end portions of the pair of vibrating arm portions.
Public/Granted literature
Information query
IPC分类:
