Invention Grant
US09052870B2 System and frame for mounting a device above a printed circuit board in an electronic device
有权
用于将设备安装在电子设备中印刷电路板上方的系统和框架
- Patent Title: System and frame for mounting a device above a printed circuit board in an electronic device
- Patent Title (中): 用于将设备安装在电子设备中印刷电路板上方的系统和框架
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Application No.: US14448222Application Date: 2014-07-31
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Publication No.: US09052870B2Publication Date: 2015-06-09
- Inventor: Chao Chen , Tim Kyowski , Jason Griffin
- Applicant: BlackBerry Limited
- Applicant Address: CA Waterloo, Ontario
- Assignee: BLACKBERRY LIMITED
- Current Assignee: BLACKBERRY LIMITED
- Current Assignee Address: CA Waterloo, Ontario
- Agency: Perry + Currier, Inc.
- Main IPC: H05K5/00
- IPC: H05K5/00 ; G06F1/16 ; H04M1/02 ; H05K7/14

Abstract:
The disclosure describes a system and a frame for mounting a display device above a printed circuit board (PCB) in within a housing of an electronic device. The system comprises: a frame section formed to be located on the PCB about a surface device on a surface of the PCB, the frame section comprises a plurality of connected bars, one of the plurality of bars having a depression in its top surface to allow a connector of the display device to fit against the frame section, the frame section being securable to the PCB such that at least a part of the surface device is surrounded by the frame section.
Public/Granted literature
- US20140340824A1 SYSTEM AND FRAME FOR MOUNTING A DEVICE ABOVE A PRINTED CIRCUIT BOARD IN AN ELECTRONIC DEVICE Public/Granted day:2014-11-20
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