Invention Grant
- Patent Title: MEMS switches and other miniaturized devices having encapsulating enclosures, and processes for fabricating same
- Patent Title (中): MEMS开关和具有封装外壳的其它小型化器件及其制造方法
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Application No.: US13623222Application Date: 2012-09-20
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Publication No.: US09053874B2Publication Date: 2015-06-09
- Inventor: John E. Rogers , Michael R. Weatherspoon
- Applicant: Harris Corporation
- Applicant Address: US FL Melbourne
- Assignee: Harris Corporation
- Current Assignee: Harris Corporation
- Current Assignee Address: US FL Melbourne
- Agency: Fox Rothschild LLP
- Agent Robert J. Sacco, Esq.
- Main IPC: H01L21/48
- IPC: H01L21/48 ; H01H1/00 ; H01H49/00 ; H01H59/00
Abstract:
Miniaturized devices such as MEMS switches (10) have encapsulating enclosures (100). The enclosure (100) and the remainder of the switch (10) are fabricated on a concurrent basis by depositing layers of an electrically-conductive material, such as copper, on a substrate (26).
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