Invention Grant
- Patent Title: Bond pad design for improved routing and reduced package stress
- Patent Title (中): 焊盘设计，改善布线和降低封装应力
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Application No.: US13167906Application Date: 2011-06-24
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Publication No.: US09053943B2Publication Date: 2015-06-09
- Inventor: Yi-Mang Chou , Yian-Liang Kuo
- Applicant: Yi-Mang Chou , Yian-Liang Kuo
- Applicant Address: TW
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW
- Agency: Lowe Hauptman & Ham, LLP
- Main IPC: H01L23/528
- IPC: H01L23/528 ; H01L23/00
Abstract:
A bond pad design comprises a plurality of bond pads on a semiconductor chip and a plurality of under-bump metallurgy (UBM) layers formed on respective bond pads of the plurality. At least one of the bond pads has an elongated shape having an elongated portion and a contracted portion, the elongated portion oriented substantially along a stress direction radiating from a center to the periphery of the chip.
Public/Granted literature
- US20120326336A1 BOND PAD DESIGN FOR IMPROVED ROUTING AND REDUCED PACKAGE STRESS Public/Granted day:2012-12-27
Information query
IPC分类:
